Negotiable
The date of payment from buyers deliver within days
Beijing
Long-term effective
2021-12-05 21:13
270
ulike1(Mr.)
Beijing
Floor 2, Building C, Huafeng Second Industrial Fengze, Xixiang Aviation Road, Bao'an District, Shenzhen, Guangdong, China
6-Layer through hole circuit
Layer count:6
Board thickness:1.0mm
Raw material:FR4 TG170
Heavy copper:1oz
Soldermask:Black
Min.line width/space:0.075mm
Minimum hole diameter:0.2mm
Surface finishing:Immersion gold
BGA design
http://www.ulikepcb.com/